中文版 ENGLISH
Email:yxatmg@163.com
Your current location：Home > Product > Electronic Packaging Material

Electronic Packaging Material

  • Tungsten Copper Alloy WCu Base Flange Heat Sink

    Tungsten Copper Alloy WCu Base Flange Heat Sink

    more

  • Molybdenum Copper Alloy MoCu Base Flange Heat Sink

    Molybdenum Copper Alloy MoCu Base Flange Heat Sink

    more

  • CuMo70CuCu CPC Base Flange Heat Sink

    CuMo70CuCu CPC Base Flange Heat Sink

    more

  • Cu Mo Cu CMC Base Flange Heat Sink

    Cu Mo Cu CMC Base Flange Heat Sink

    more
Material
Tantalum
Niobium
Molybdenum& Tungsten
Titanium
Product
Medical Metal Material
Electronic Packaging Material
High Temperature Alloy Materials
High Purity Tantalum Niobium And Alloy Materials
Hot Zone And Components For Vacuum Furnace
Contact us
Telephone：+86-379-62769668
Mobile：+86 15838854614
Email：yxatmg@163.com
Address：XIYUAN High Tech Industry Zone, Luoyang,China

copyright © 2020 YuXiang Advanced Technology & Materials Co.,LTD Copyright： Technical support：Qingfeng, Luoyang Record No：Henan ICP 13025174-1