Cu/Mo70Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu:Mo-Cu:Cu is 1:4:1. It has different CTE in X and Y direction, higher thermal conductivity than that of W(Mo)-Cu、Cu/Mo/Cu and more cheap. All types of Cu/Mo70Cu/Cu sheets can be stamped into components
Large sized sheets available (length up to 400mm, width up to 200mm)
More easily to be stamped into components than CMC
Very strong interface bonding which can repeatedly resist 850℃ heat shock
Higher thermal conductivity and lower cost
Its expansion coefficient and thermal conductivity can be designed for use in rf, microwave and semiconductor high-power devices.