It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applications
High thermal conductivity due to no sintering additives were used
Relatively small density
Stampable sheets available (Mo content not more than 75wt.%)
Semi-finished or finished (Ni/Au plated) parts available
It is suitable for manufacturing the molybdenum-copper alloy rod used as heat sink sealing material, aluminum oxide ceramic sealing material and structural material for military high-power microelectronic devices.